Intacero’s product engineers work with the customer to determine each process’s needs and the best way to address them. Our experts are here to help determine areas of opportunity, reduce costs and improve productivity. We also offer training for the customer’s personnel on issues related to flat steel products.
Intacero provides Formability analysis (Formability Limit Diagram (Circle grid Analysis) and Thickness Strain Analysis (TSA)).
Circle Grid Analysis and Thickness Strain Analysis are tools for evaluating the stamping process and to determine if steel blank is appropriate for the current state of tool development and stamping process. It's called circle grid because in the traditional application, circles are electrochemically etched on the sheet steel surface. Thickness strain analysis is conducted with an ultrasonic thickness gauge or a pair of micrometer/calipers.
Formability Analysis: high quality strain and panel analysis to determine stability, robustness and die improvement opportunities. Lead die improvement planning with die shop personnel, and create status and reference panels for use on the floor.
Circle grid analysis provides a key output measurement – strains. After forming a blank that has been gridded, output measurements can be taken regarding strain in the finished part. When these measurements are plotted on a forming limit diagram, we can evaluate the nearness of the stamping to failure and develop strategies to increase the safety margin of the stamped part.
Strain measurements can give you:
The following images are examples of CGA and TSA studies.